GB T1 copper plate manufacturers, suppliers imported C1020 copper plate 
 Catalog 
 1 Materials Overview 
 2 Material Name 
 3 Material Properties 
 4 Scope 
 5 The main chemical components 
 6 Mechanical Properties 
 7 Heat treatment specifications 
 8 implementation of standards 
 9 certification system 
 10 Information 

 Keywords: T1 copper mill, C1020 copper plate manufacturers, T1 copper plate supply, C1020 copper plate supplier, T1 copper plate wholesale, C1020 copper plate wholesalers 
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 1 Overview of the national standard T1 copper plate 
 Copper plate was purple because of its name. It may not be pure copper, and sometimes a small amount of oxygen elements or other elements to improve the material and performance 
 And, therefore, classified as copper alloy. Chinese copper plate material by processing components can be divided into: ordinary copper plate (T1, T2, T3, T4), oxygen-free copper (TU1, TU2, and high-purity, oxygen-free copper vacuum 

 ), Deoxidized copper (TUP, TUMn), add a small amount of special alloying elements copper (copper, arsenic, tellurium copper, silver and bronze) four. Copper plate of the electrical conductivity and thermal conductivity second only to silver, a wide range 

 For the production of electrical conductivity, thermal equipment. Copper plate in air, water and certain non-oxidizing acids (hydrochloric acid, sulfuric acid), alkali, salt solution and various organic acids (acetic acid, citric acid 

 ) Has a good corrosion resistance, for the chemical industry. T1 copper plate to the highest copper content of copper, the purity up to 99.95%, also the most expensive. Net commonly used in industry 

 Copper T2 copper plate, and affordable. 

 2 Import C1020 copper plate stick material name 
 Industrial metal copper, purity higher than 99.5%, was purple, also known as pure copper. It has excellent electrical conductivity, thermal conductivity, corrosion resistance and weldability, the conductivity at room temperature, second only to 

 In silver. Processing of copper plate, which was divided into four kinds of grades, that I, II, III and IV copper plate, purity of 99.95%, 99.90%, 99.70% and 99.5%; that 

 The so-called T1, T2, T3, T4. 

 3 GB T1 copper plate features 
 Good electrical conductivity, thermal conductivity, corrosion resistance and workability, welding and brazing. With lower conductivity, thermal conductivity less impurities, small amounts of oxygen on the electrical conductivity, thermal and processing properties of film 

 Sound small, but easy to cause the "hydrogen disease", not at high temperature (eg> 370 ℃) reducing atmosphere processing (annealing, welding, etc.) and use. Often contain oxygen, sulfur, lead, arsenic, bismuth 

 , Phosphorus and other impurities. Has excellent electrical conductivity, thermal conductivity, moderate mechanical properties. Can be used for the preparation of copper alloy and alloy elements. Electric fields are widely used for electrical conductivity, 

 Thermal conductivity materials. With the reverberatory furnace and other pyrometallurgical copper, refined copper electrolysis. Preparation or sources: natural copper are important chalcopyrite, chalcocite, cuprite and malachite, 

 However, all low grade. Sulfide ores can be calcined to a small amount of sulfur dioxide and coke after crude copper eutectic, and then reduced to blister copper, and finally refining electrolysis derived. Copper plate 

 Trace impurities on the conductivity of copper, thermal conductivity have a significant effect. Including titanium, phosphorus, iron, silicon significantly lower conductivity, and cadmium, and zinc is little effect. Oxygen, sulfur, selenium 

 , Tellurium, etc. in the solid solubility of copper in small, brittle compounds can be generated with copper, has little effect on the conductivity, but can reduce the processing of plastic. Ordinary copper plate in hydrogen or carbon monoxide also 

 Immunogenicity when heated in an atmosphere of hydrogen or carbon monoxide is easy and cuprous oxide grain boundaries (Cu2O) effect, resulting in high pressure steam or carbon dioxide gas, copper can break. This phenomenon is often 

 Called copper "hydrogen disease." Oxygen on the copper welding and harmful. Bismuth or lead and copper to generate low melting point eutectic, thermal embrittlement of copper; and brittle thin film of bismuth was distributed at the grain boundaries, and 

 Of copper produced cold crisp. Phosphorus can significantly reduce the conductivity of copper, but copper can increase the fluid flow, improve weldability. Amount of lead, tellurium, sulfur, etc. can improve machinability. 


 4 Scope of imports C1020 copper plate 
 Pink and shiny metal, hard and tough, the rich have a high ductility and thermal conductivity and electrical conductivity. 
 Solution: do not dissolve in hydrochloric acid or sulfuric acid. Soluble in hot concentrated nitric acid and sulfuric acid. Alkali corrosion. 
 Purposes: for copper, copper, electrodes, electro-forming panels, switches, chemicals, alloys (eg brass, bronze, German copper, copper-nickel alloy, etc.), and electroplating. With excellent 

 Good thermal conductivity of the conductive ﹑ ﹑ ductility and corrosion resistance. Mainly for the production of the generator bus ﹑ cable ﹑ ﹑ ﹑ transformer electrical switchgear equipment and heat exchanger pipes ﹑ ﹑ 

 Solar heating devices such as flat-plate collector thermal equipment. Commonly used copper alloy into copper-nickel alloy brass ﹑ ﹑ bronze three categories. 

 5 GB main chemical components of T1 copper plate 
 Copper + silver CuAg: ≥ 99.95 
 Phosphorus P: ≤ 0.001 
 Tin Sn: ≤ 0.002 
 Zinc Zn: ≤ 0.005 
 Lead Pb: ≤ 0.005 
 Lead Pb: ≤ 0.005 
 Ni-Ni: ≤ 0.005 
 Iron Fe: ≤ 0.005 
 Beryllium Sb: ≤ 0.002 
 Sulfur S: ≤ 0.005 
 Arsenic As: ≤ 0.002 
 Bi Bi: ≤ 0.001 
 Oxygen O: ≤ 0.06 
 Note: ≤ 0.05 (impurity) 

 6 Import C1020 mechanical properties of copper plate 
 Tensile strength σb (MPa): ≥ 275 
 Elongation δ10 (%): ≥ 5 
 Elongation δ5 (%): ≥ 10 
 Note: The vertical bar tensile properties at room temperature 
 Sample size: the diameter or the side away from 5 to 40 

 7 GB T1 copper plate heat treatment specifications 
 Thermal processing temperature of 900 ~ 1050 ℃; annealing temperature of 500 ~ 700 ℃; work hardening of copper recrystallization starting temperature of 200 ~ 300 ℃. 

 8 execute imports C1020 standard copper plate 
 GB system: GB / T 2059-2000 import system: JISH 3100 

 9 GB T1 copper board certification system 
 ISO9001-2000 quality certification, SGS environmental protection certification standards. 

 10 Import C1020 copper plate information 
 T1 copper plate copper row of T1 T1 T1 copper wire with a copper T1 T1 copper rods Copper 

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